Amakuru
Uburyo bwo gupakira Leadframe: Incamake y'ikoranabuhanga yuzuye
Gupfunyika hakoreshejwe leadframe biracyari imwe mu ikoranabuhanga ryamamaye cyane mu nganda za semiconductor, bitanga igisubizo gihendutse cyo kurinda imiyoboro y’amashanyarazi ihuriweho mu gihe bitanga amashanyarazi ahuza sisitemu zo hanze. Iyi nyandiko igaragaza ibisobanuro birambuye bya tekiniki ku buryo bwo gupfunyika leadframe, kuva ku gutegura wafer kugeza ku gutegurwa kwa nyuma, hibandwa ku bipimo by'ingenzi by'imikorere n'uburyo bwo kugenzura ubuziranenge.
Uburyo bwo guteranya substrate ya IC: Incamake y'ikoranabuhanga yuzuye
Iteraniro rishingiye kuri substrate ya IC Igaragaza inkingi nyamukuru y'uburyo bwo gupakira ibikoresho bya semiconductor bigezweho, itanga ubwinshi bw'imiyoboro y'amashanyarazi, imikorere myiza y'amashanyarazi, no koroshya imiterere ugereranije n'uburyo busanzwe bwo gupakira ibikoresho. Iyi nyandiko igaragaza ibisobanuro birambuye bya tekiniki ku buryo bwo gupakira ibikoresho bya substrate, hibandwa ku mapaki y'umuryango wa Ball Grid Array (BGA), ikubiyemo inzira yose y'ibikorwa kuva mu gutegura wafer kugeza ku igeragezwa rya nyuma no kugaragaza ibipimo by'ingenzi by'imikorere n'ibipimo byo kugenzura ubuziranenge.
Itandukaniro riri hagati ya FCBGA na WBBGA
FCBGA (Flip-Chip Ball Grid Array) na WBBGA (Wire Bonded Ball Grid Array) ni ikoranabuhanga ritandukanye ryo gupakira chip, ritandukanye cyane cyane mu buryo bwo guhuza no guhuza bump.
Imiterere y'Ikoreshwa ry'Umupfundikizo wa FCBGA
Umupfundikizo wa BGA (Ball Grid Array package lift) ukoreshwa cyane cyane mu gupfunyika chips zikora neza cyane, cyane cyane mu ikoranabuhanga rya Flip-Chip, kugira ngo urinde chips no kunoza imikorere y'ubushyuhe.
Inzira zo guteza imbere imiterere y'abayobozi
Inganda zikora ibijyanye n’ubucuruzi bw’inganda zikomeje kugaragaza iterambere rirambye vuba aha, aho biteganijwe ko ingano y’isoko izagera kuri miliyari 35.2 z’amayuani mu 2029, kandi gusimbuza ibicuruzwa byo mu gihugu biri kwihuta.