Uburyo bwo guteranya substrate ya IC: Incamake y'ikoranabuhanga yuzuye
1. Intangiriro
Gupfunyika hakoreshejwe substrate, cyane cyane imiterere ya BGA, byabaye ikoranabuhanga rikomeye ryo guteranya insinga zikora neza kandi zifite ubushobozi bwo gushyiramo I/O nyinshi. Bitandukanye na paki za leadframe zikoresha frame y'icyuma mu guhuza insinga, paki za substrate zikoresha laminated organic cyangwa ceram.Ic Substrate itanga urwego rwinshi rw'inzira, ingufu n'imirongo yo hasi, hamwe n'aho umupira w'amashanyarazi uhurira.
Iyi substrate ubwayo ni imiterere y’ibice byinshi, ubusanzwe yubakishijwe resin ya bismaleimide triazine (BT) hamwe n’ibikoresho byo kongeramo ikirahure cyangwa polyimide. Ku bwoko bwa substrate ya ceramic, inzira yo kuyikora ikubiyemo gukoresha ubushyuhe bwinshi mu nyubako za ceramic zifite ibice byinshi kugira ngo haboneke substrate zifite ibyuma byinshi.
Mu gihe amapaki ya substrate asangira igice cya mbere cy'igikorwa cyo guteranya n'amapaki ya leadframe—harimo gusya inyuma, gukata, gufunga, Guhuza insinga cyangwa guhuza uduce duto, no gushushanya—imikorere y’inyuma iratandukanye cyane. Uduce duto dushyirwamo umupira wo gusoda, kongera gusohoka, gusimbuka, no kugenzura bwa nyuma, mu gihe uduce duto dukenera gukata, gusigwa, no gukora.
2. Icyiciro cyo gutegura umugati
2.1 Gutunganya inyuma
Uburyo bwo gupakira butangirana no gusya wafer inyuma, bigabanura ubugari bwa wafer kugeza ku bipimo bikwiye ku ipaki ya nyuma. Ku bijyanye n'imiterere ya stacked-die, wafers zirasya ku buryo bworoshye cyane kugira ngo zihuze n'ibice byinshi by'imashini mu burebure bw'ipaki.
Gusya inyuma bikora urukurikirane rukurikirane: gusya neza bikuraho ibikoresho byinshi, gusya neza bitanga ubuziranenge, kandi gusiga neza bikuraho uduce duto two hejuru dushobora gutuma habaho kwangirika. Kaseti irinda ishyirwa ku buso bukora mbere yo gusya kugira ngo hirindwe kwangirika k'uruziga. Nyuma yo gusya, kaseti yo gushyiraho ishyirwa inyuma ku mpande zombi, hanyuma kaseti ishyirwa ku mpande zombi kugira ngo ikoreshwe.
2.2 Gukata Wafer
Gukata wafer (gukata) bitandukanya wafer yatunganyijwe mo uduce duto dukoresheje icyuma gizunguruka gifite diyama. Ku duce duto duto, gukata laser bitanga ubundi buryo bwo kudakora ku buryo bigabanya ibyago byo kwangirika. Nyuma yo gukata, uduce dusukurwa mu mazi yakuwemo iyoni kugira ngo dukurweho umukungugu wa silikoni n'umuriro udahinduka wiyongera mu gihe cyo gukata.
3. Uburyo bwo Gufataho Die
Gufata icyuma gifata icyuma gifata icyuma kimwe kimwe kiva kuri kaseti yo gushyiramo kikajya ku gice cy’icyuma gifata icyuma. Icyo gikorwa gisaba gukora neza no gutoranya no gushyiramo icyuma gifata icyuma neza.
Ibikoresho bifatana biri mu byiciro bibiri:
Epoxy yuzuye ifeza ishyirwa ku gapapuro k'icyuma gikingira umwotsi hakoreshejwe agakoresho ko gukata syringe cyangwa imashini icapye mbere yo gushyiramo icyuma. Izi kole zikora zituma icyuma gikingira umwotsi gihura neza n'icyuma gikingira umwotsi.
Filimi zifata ku gikoresho cyangwa filimi zifata ku gikoresho cyo gusya zishyirwa ku gikoresho cyo gusya inyuma nyuma yo gusya no gukata hamwe na filimi. DAF icibwa icyarimwe na filimi, bigatuma filimi ifata ku gikoresho cyo gusya icyarimwe n'ifata ku gikoresho cyo gusya. Ubu buryo ni bwiza cyane cyane ku miterere y'igikoresho cyo gusya.
Igitekerezo cy'ingenzi mu gihe cyo gufata irangi ni imbaraga z'ikirahure cya kaseti yo gushyiramo. Ikirahure kigomba kugumana imbaraga zikomeye zo gufatana mu gihe cyo gukata irangi ariko kigacika intege bihagije iyo cyashyizwemo imirasire ya ultraviolet mbere yo gufata irangi, bigatuma irangi rikurwaho neza nta kwangirika kwabyo.
4. Guhuza: Uburyo bwo guhuza amashanyarazi
Guhuza amashanyarazi bishyiraho inzira z'amashanyarazi hagati y'udupira two guhuza ibyuma n'intoki zo guhuza ibyuma. Uburyo bubiri bw'ingenzi bukoreshwa: guhuza ibyuma n'uburyo bwo guhuza ibyuma.
4.1 Guhuza insinga
Guhuza insinga hakoreshejwe insinga za zahabu cyangwa umuringa zifite ubushyuhe, umuvuduko, n'ingufu kugira ngo zihuze utwuma n'udusimba mu buryo bw'amashanyarazi. Urukurikirane rw'ibikorwa rukurikira izi ntambwe:
Umurizo w'insinga uva mu muyoboro w'amaraso ushongeshwa n'umuriro w'amashanyarazi, bigatuma habaho umupira w'uruziga unyuze mu gushyuha k'ubuso.
FAB ishyirwa ku gice cyo gufunga, igakora ipfundo rya mbere.
Umuyoboro w'amaraso ugenda werekeza ku rutoki rw'umugozi, utanga insinga kugira ngo ukore imiterere y'umuyoboro ikenewe.
Insinga ikandagirwa ku rutoki rw'ifatanirizo kugira ngo ikore ifatanirizo rya kabiri.
Insinga irakururwa inyuma igacibwa, bitegura ipfundo ritaha.
Ku bijyanye n'ibikoresho byo mu bwoko bwa substrate, insinga za zahabu zikunze gukoreshwa bitewe n'ubushobozi bwazo bwiza bwo gutwara amashanyarazi no kuyacukura. Insinga z'umuringa, harimo n'umuringa wasizwe na palladium (Pd-Cu), nazo zagiye zikoreshwa mu kugabanya ikiguzi no kunoza imikorere y'amashanyarazi.
Mbere yo gufatanya insinga, hakorwa isuku ya plasma kugira ngo hakureho imyanda ku buso bw'ifatanya, bityo habeho gufatana neza.
4.2 Guhuza na Flip-Chip no Kuzuza Underfill
Guhuza ibyuma bicukura ibyuma bitera uduce duto two gusoda ku buso bw'icyuma kandi bikabishyira ku dupapuro duhuye nabyo kuri substrate, bitanga amashanyarazi meza cyane ugereranije no guhuza ibyuma binyuze mu gukuraho imiyoboro miremire y'ibyuma.
Uburyo bubiri bwo guhuza uduce duto (flip-chip bonding) bukunze gukoreshwa:
Uduce duto two gushongesha dushongeshwa ku bushyuhe bwinshi kugira ngo dufatanye n'agace k'umushongi.
Ubushyuhe n'umuvuduko bishyirwa ku ihuriro kugira ngo habeho isano iri hagati y'urupapuro n'urukuta.
Ubudasa bw'ubushyuhe hagati ya silicon chip na substrate y'umwimerere butera stress idashobora gukemurwa n'agahu gusa. Bityo, kuzuza hasi birakenewe kugira ngo habeho ubwiza bw'ingingo za solder. Ibikorwa byo kuzuza hasi birimo:
Ibikoresho byo kuzura munsi y'umuyoboro bishyirwa ku ruhande rw'ikiyiko, byuzuza icyuho kiri hagati y'utubyimba binyuze mu gikorwa cyo mu miyoboro y'amaraso.
Iyi epoxy molding compound ikora imirimo ibiri nk'ikingira n'iyuzuza, ikuzuza umwanya uri hagati y'utubyimba mu gihe cyo kuyibumba.
5. Gutunganya: Gufunga no Kurinda
Gutunganya ibintu bitwikira igice cy’ubutaka cyakusanyijwe, bikarinda inyubako zifatanye n’izihuza ibintu kwangirika kwa mekanike n’ibintu byanduza ibidukikije. Epoxy molding compound (EMC) ni yo ikoreshwa cyane mu gukusanya ibintu.
Uburyo bwo gushushanya butanga imbogamizi zidasanzwe ku mapaki ya substrate. Uko umubare w'udupfunyika tw'ibice byiyongera mu gihe ubugari bw'ibice bigabanuka, icyuho kiri hagati ya chip n'inyuma y'ibice bikomeza kugabanuka. Byongeye kandi, substrate zirimo kwiyongera mu bunini kugira ngo zitunganye udupfunyika twinshi mu matsinda manini, bigabanya ikiguzi cyo gukora. Iyi miterere yatumye gushushanya ku buryo bwo kwimura ibintu birangira.
Gucura ibintu bitoroshyeyagaragaye nk'igisubizo kuri izi mbogamizi. Mu gukamura ibintu mu buryo bwo gukanda:
- Ifu y'ibumba ibanza kuzuzwamo ifu ya EMC.
- Uduce dushyirwa mu ibumba.
- Ubushyuhe n'umuvuduko birashyirwa, bigatuma ifu ya EMC ihinduka amazi kandi yuzura umwanya.
- Kubera ko EMC ihita iba amazi kandi ikuzuza umwanya idatemba, nta kibazo cyo kuzuza gihari ndetse no mu cyuho gito kiri hagati ya chip n'aho ipakiye.
6. Gushyira ikimenyetso
Gushyira ikimenyetso ku makuru y'ibicuruzwa—harimo ubwoko bwa semiconductor, uwabikoze, imiterere, ibimenyetso, imibare, cyangwa inyuguti—ku buso bwa Ipaki ya Semiconductors. Aya makuru ni ingenzi cyane mu gukurikirana icyateye kwangirika kw'ibicuruzwa. Gushyira ikimenyetso kuri laser ni bwo buryo bukoreshwa cyane mu gupakira pulasitiki, aho gukoresha EMC y'umukara ari byo bikunze gukoreshwa mu gusobanya neza.
7. Gushyiraho umupira wo gusoda
Gushyiraho imipira yo gusoda ni inzira itandukanya inyuma y’aho ipakiye, ishyiraho inzira z’amashanyarazi n’imibanire ya mekanike hagati y’iyo paki n’imiyoboro yo hanze.
Uburyo bwo gushyiraho umupira wo gusoda bukurikiranye:
Flux ishyirwa ku dupapuro tw’ubutaka kugira ngo ikureho imyanda na okiside mu gihe cyo kongera gusohoka, bigatuma habaho gushonga kumwe no gutanga ubuso busukuye.
Udupira two gusoda dushyirwa ku dupapuro tw’imashini hakoreshejwe igikoresho cyihariye cyo gukurura cyangwa gucapa stencil. Udupira dutanga uburyo bwo gufatana by’agateganyo kugira ngo udupira dukomeze guhagarara neza.
Iteraniro rinyura mu itanura risubiramo amazi aho udupira two gushongesha dushonga, bigahuza neza n'udupira tw'ibumba.
Ibisigazwa bikurwaho hakoreshejwe isuku y’inorganic idafite CFC.
Imiterere y'ubushyuhe mu gihe cyo kongera gusohoka igenzurwa neza hifashishijwe ibipimo birimo igihe cyo gushyushya mbere y'uko ibintu bihagarara, ubushyuhe bwinshi, n'umuvuduko wo gukonjesha kugira ngo ingingo zishyirweho neza nta kwangirika kw'ubutaka.
Imiterere isanzwe y'aloyi ikoreshwa mu gusoda irimo:
8. Igice cy'ipaki Inganda
Urusobe ubwarwo ni igice cy'ingenzi gisaba uburyo buhambaye bwo gukora. Ku rusobe rw'ibintu bikomoka ku bimera, urusobe rw'ibikorwa rukubiyemo:
Agapapuro k'umuringa gafite ubugari bukabije (ubugari bwa 12–18μm) gashyizwe ku mpande zombi z'isahani y'ibanze ya BT resin/glass.
Binyuze mu myobo bicukurwa kandi bigashyirwamo ibyuma kugira ngo habeho uburyo bwo guhuza ibintu buhagaze.
Imiterere ikorwa ku mpande zombi z'ubutaka hakoreshejwe tekiniki zisanzwe za PCB, ikora imirongo y'ubuyobozi, electrodes, n'urutonde rw'uturere two gushyiramo umupira.
Hashyizweho agapfukamunwa gapfukamunwa, gafite imiterere igaragaza ahantu hakoreshwa electrode n'aho bapfukamunwa.
Irangi ryo hejuru (urugero, nikeli/ipamba rya zahabu) rishyirwa ku dupapuro twambaye ubusa kugira ngo ryongere ubushobozi bwo gusonerwa.
Uburyo bugezweho bwo gukora substrate bukemura ikibazo cyo gutunganya substrate nto cyane. Mu guhuza substrate ebyiri nto cyane ku mpande z’uruhande rw’icyuma gitwara ibintu, ubugari bw’imiterere ikenewe mu gukora buriyongereye, bigatuma ibikoresho bisanzwe bikoreshwa mu gutunganya substrate bishobora gukora substrate nto cyane nta shoramari ryihariye ry’ibikoresho.
9. Gutunganya no Gutunganya Byarangiye
Gutandukanya ibintuitandukanya amapaki atandukanye n'ahari substrate hakoreshejwe uburyo bwo gukata, gukata hakoreshejwe laser, cyangwa ubundi buryo bwo gutunganya neza.
Nyuma yo gukoresha uburyo bwo gupima, amapaki akurikira:
- Igenzura rya nyuma ry'amaso: Igenzura ry’amatara ryikora rigaragaza inenge nko kutumvikana neza, ibiraro byo gusoda, cyangwa imiturire.
- Isuzuma ry'amashanyarazi: Gukomeza, kwishyira mu kato, no kugenzura ubuziranenge bw'ibimenyetso.
- Isuzuma rya X-ray: Ku bintu byihishe nko guhuza solder mu mapaki ya flip-chip n'imiyoboro y'umupira wa solder.
- Isuzuma rifunguye/rigufi: Kugenzura uburyo amashanyarazi ahoraho.
- Gupakira: Amapaki arangiye ashyirwa mu dusanduku kugira ngo yoherezwe.
10. Impinduka mu mapaki
PBGA ni igishushanyo mbonera cya BGA gikozwe muri pulasitiki gikozwe muri BGA ikoresheje substrate ya BT ifite urwego rwa 2, 4, cyangwa 6 hamwe n'umubyimba wa 0.8, 1.0, cyangwa 1.27mm no hejuru. Itanga uburyo bwo gusimbuza I/O bwinshi bwa QFP iyo I/O irenze ubushobozi bwa QFP-256, hamwe n'imikorere myiza y'amashanyarazi n'ubushyuhe binyuze mu byiciro byinshi byo kuzenguruka.
PBGA ni nziza cyane kuri microprocessors, DSPs, ASICs nyinshi, gate arrays, memory, na chipsets za PC, ndetse na porogaramu zigendanwa zirimo mudasobwa zigendanwa, izidakoresha insinga, na mudasobwa zigendanwa.
TFBGA/VFBGA ni udupaki tw’udupira tw’insinga, dukozwe mu buryo bw’icyuma, dukozwe mu buryo bwa “chip-scale”, dutanga imiterere mito n’imiterere yoroheje. Utwo dupaki dukoresha “matrix format substrate” dufite uburyo busanzwe bwo gukurura udupira tw’insinga, butuma dufata ingano zitandukanye z’udupaki, bugatanga uburyo bworoshye bwo gukora no kugabanya igihe cyo kugurisha.
TFBGA/VFBGA ikwiriye ibikoresho bya "memory", "analog", "Flash", "ASICs", "RF", na "simple PLDs" aho ikiguzi n'umwanya ari ibintu by'ingenzi.
Kugira ngo ibikoresho byizewe cyane kandi bikoreshwe inshuro nyinshi, ibikoresho bya ceramic bitanga ubushobozi bwo kudahungabana no gukora neza mu bushyuhe. Ibikoresho bya CBGA bikorwa binyuze mu nzira zo gushyushya ibikoresho bya ceramic mu byiciro byinshi, ariko bihura n'imbogamizi zirimo kudahuza kwa CTE hagati y'ibikoresho bya ceramic, chip, na PCB—uburyo bw'ibanze bwo gucika intege bukemurwa binyuze mu miterere ya CCGA cyangwa ibikoresho bya ceramic bya HITCE.
11. Ibitekerezo ku igenzura ry'ubuziranenge
Kugenzura inzira mu gihe cyose cyo gupakira ibintu mu buryo bwa substrate ni ingenzi cyane kugira ngo umusaruro ugere ku musaruro mwinshi kandi wizewe:
- Ubugari bw'ubutaka: Kugenzura ikoreshwa ry'imashini mu gihe cyo gushongesha no gushushanya ni ngombwa.
- Ubusugire bw'ingoboka: Gupima no gukata buri gihe insinga bishingira ku kwizerana.
- Ubwishingizi bw'ibikenewe mu gihe cyo kurangiza imirimo: Igenzura rituma icyuho cy’ibice binini by’icyuma gishyuha cyuzuzwa neza.
- Ubunyangamugayo bw'umupira w'ubushoferi: Isuzuma rya X-ray rigenzura imiterere y'ingingo zisoda neza.
- Ubwiza bw'ifatizo: Gukoresha kole idafite ubusa ni ingenzi cyane mu mikorere y'ubushyuhe n'imikorere ya mekanike.
12. Umwanzuro
Gupfunyika hakoreshejwe substrate, cyane cyane imiterere ya BGA, bitanga urubuga rwo guteranya ibikoresho bya semiconductor bigezweho kandi bifite uburyo bworoshye bwo guteranya. Uburyo bwo gukora ibintu—kuva ku gutegura wafer kugeza ku gukora die attach, guhuza, gushushanya, gushyiramo umupira wo gusoda, no kugerageza kwa nyuma—bitanga inyungu zikomeye ugereranyije n’udupaki twa leadframe harimo ubucucike bwinshi bwa I/O, imikorere myiza y’amashanyarazi, kunoza imicungire y’ubushyuhe, no koroshya imiterere.
Ingendo zigenda ziyongera zirimo gukoresha substrates ntoya zikoreshwa n'uburyo bugezweho bwo gutunganya ibikoresho, gukanda kugira ngo habeho gufunga neza, hamwe n'ibyuma bidafite icyuma gishongesha ibyuma kugira ngo bihuze n'ibidukikije. Uko ubucucike bw'ibikoresho bikomeza kwiyongera n'ingano y'ibikoresho bikomeza kugabanuka, ikoranabuhanga ryo gupakira substrates rizakomeza gutera imbere kugira ngo rihuze n'ibyifuzo by'ibikoresho bya semiconductor byo mu gisekuru gitaha.