Uburyo bwo gupakira Leadframe: Incamake y'ikoranabuhanga yuzuye
1. Intangiriro
Gupfunyika ibyuma bipfunyika bifata amatara bigaragaza uburyo busanzwe ariko buhora buhinduka bwo guteranya ibikoresho bya semiconductor. Urwego rw'amashanyarazi rukora nk'inyubako y'icyuma ishyigikira ibyuma ndetse n'uburyo bw'amashanyarazi bwo guhuza ibikoresho, igizwe n'icyuma gipfunyika icyuma gifata amatara n'intoki zitanga uburyo bwo kwerekana ibimenyetso. Uburyo bwo gupfunyika buhindura icyuma gipfunyika gikora igice kirinzwe kandi cyizewe gikwiriye gushyirwa ku buso cyangwa mu mwobo ku mbaho zacapwe.
Urugendo rw'ibanze rw'ibikorwa rugizwe n'ibikorwa bitandatu by'ibanze: gusya wafer backgrinding, gukata wafer, gufunga die attach, Guhuza insinga, gushushanya, no gutunganya nyuma yo gushushanya (gukata, gusiga, no gushushanya). Buri ntambwe isaba kugenzura neza kugira ngo hamenyekane ko umusaruro w’ibicuruzwa ari uw’ukuri kandi utanga umusaruro.
2. Icyiciro cyo gutegura umugati
2.1 Gutunganya inyuma
Uburyo bwo gupfunyika butangirana no gusya wafer inyuma, bigabanura ubugari bwa wafer ku bipimo bihuye n'imiterere ya nyuma y'ipaki. Ku mapaki y'imashini imwe, wafers zikunze gusya kugeza ku bunini buri hagati ya mikorometero 200 na 250. Amapaki afunze neza asaba wafers zoroshye cyane kugira ngo zijyane n'ibice byinshi by'ipaki.
Uburyo bwo gusya inyuma bukoresha uburyo bugenda butera imbere: gusya cyane bikuraho ibikoresho byinshi ku muvuduko mwinshi, hagakurikiraho gusya neza kugira ngo bibe byiza, hanyuma bigasozwa no gusya kugira ngo hakurweho uduce duto two ku buso. Ubukana bw'ubuso bufitanye isano itaziguye no kwangirika mu gihe cyo gukoresha nyuma—ubuso bukozwe neza bugabanya cyane ibyago byo kwaguka kw'imivu.
Kaseti irinda gusya inyuma ishyirwa ku buso bukora bwa wafer mbere yo kuyisya kugira ngo hirindwe kwangirika k'uruziga. Nyuma yo kuyisya, kaseti yo kuyishyiraho ishyirwa inyuma kuri wafer, kaseti irinda irakurwaho, hanyuma wafer ishyirwa ku gitereko cy'impeta kugira ngo ikoreshwe.
2.2 Gukata Wafer (Gukata uduce)
Gukata wafer bitandukanya wafer yatunganyijwe mo uduce twinshi. Gukata blade, uburyo busanzwe, bukoresha icyuma kizunguruka gifite diyama kugira ngo gice ku mirongo ya scribe. Ubugari bw'umurongo wa scribe bugomba kuba bufite ubushobozi bwo kwihanganira ibyuma ariko bugatanga umwanya uhagije kugira ngo hirindwe kwangirika kw'ibikoresho byegeranye.
Ku birebana n'udupira tw'inka tworoshye cyane, habonetse ubundi buryo. Gukata udupira hakoreshejwe laser bikuraho imbaraga zo gukoranaho, bigabanya ibyago byo kwangirika. Gukata udupira mbere yo gusya (DBG) bihindura umurongo usanzwe: gukata igice bibaho mbere yo gusya inyuma, kandi gutandukana burundu bigerwaho binyuze mu kwagura kaseti.
Nyuma yo gukata, imiyoboro isukurwa mu mazi yakuwemo iyoni kugira ngo ivumbi rya silikoni n'umuvuduko udahinduka byiyongera mu gihe cyo gukata.
3. Uburyo bwo Gufataho Die
Gufata icyuma gifata icyuma gifata icyuma gifata icyuma kimwe kimwe kiva kuri kaseti yo gushyiramo icyuma kijya kuri icyuma gifata icyuma. Iyi gahunda isaba gukora neza mu gutoranya no gushyiramo icyuma, witonze cyane mu guhitamo no gukoresha kole.
Ibikoresho bifatana biri mu byiciro bibiri: kole y'amazi n'amafirime akomeye. Kole y'amazi, nka epoxy yuzuye ifeza, ishyirwa ku gapapuro k'isukari mbere yo gushyirwaho. Kole ikomeye, izwi nka die attach films (DAF) cyangwa wafer backside lamination films, ni ingirakamaro cyane ku miterere ya stack-die. DAF ishyirwa ku gasanduku k'isukari inyuma nyuma yo gusya no gukata hamwe na wafer, bigatuma habaho kole n'isukari icyarimwe.
Kugira ngo hamenyekane ko igice cyo hasi cy’urukuta gihura n’urukuta, igice cyo hasi cy’urukuta gishobora gushyirwa mu cyuma, mu gihe igice cyo hasi cy’urukuta gishyirwamo kole ikora neza. Imiterere y’urukuta rwo gushyiramo ibintu iratunganywa binyuze mu kwerekwa n’imirasire ya ultraviolet mbere yo gufatirwamo, bigatuma uruziga rugabanuka bihagije kugira ngo rugakureho urukuta rwiza kandi rugakomeza gukomera mu gihe cyo gukata.
4. Guhuza insinga: Guhuza amashanyarazi
Insinga zihuza amashanyarazi zihuza udupira tw’amashanyarazi n’udupira tw’icyuma. Insinga za zahabu zikunze gukoreshwa cyane bitewe n’uburyo zitwara amashanyarazi neza kandi zigatuma adakora neza.
Uburyo bwo guhuza insinga bukurikiza uburyo bwikora kandi bwikora:
Uburyo bwo gukora umupira w'umwuka w'ubuntu (FAB): Umurizo w'insinga uva mu muyoboro w'amaraso ushongeshwa n'umuriro w'amashanyarazi (EFO), bigatuma umupira uhinduka nk'uruziga binyuze mu gukaza umuvuduko w'ubuso.
Guhuza umupira: FAB ishyirwa ku gice cyo guhuza ibyuma, igakora ihurizo rya mbere.
Imiterere y'umuzingo: Umuyoboro w'amaraso winjira werekeza ku rutoki rw'umutwe, utanga insinga kugira ngo ukore imiterere y'uruziga ikenewe.
Guhuza mu midozi: Insinga ikandagirwa ku rutoki rw'inyuma kugira ngo ikore umugozi wa kabiri.
Imiterere y'umurizoInsinga irakururwa inyuma igacibwa, bitegura ipfundo ritaha.
Uru rutonde rusubiramo kuri buri guhuza. Ubwiza bw'imigozi bugenzurwa binyuze mu kugenzura amaso, gupima gukurura, no gupima gukata.
5. Gutunganya: Gufunga no Kurinda
Gutunganya ibyuma bitwikira icyuma giteranyije, bikarinda insinga zifatana n'izifatana kwangirika kwa mekanike n'ibintu byanduza ibidukikije. Epoxy molding compound (EMC) ni yo ikoreshwa cyane mu gukusanya ibyuma.
Uburyo bwo kwimura ibumba bukubiyemo gushyira ihuriro ry'urukiramende mu mwobo w'ibumba no gutera imvange y'ibumba ishongeshejwe ku gitutu. Ibintu by'ingenzi bigomba kwitabwaho birimo:
Kwirinda Gushyuha kw'Ibihumyo: Gusohora kw'ibimera biva mu mwenge w'urukiramende bitera urumuri—uduce duto twa resin tubangamira ibikorwa byo gusora nyuma yaho. Kuzuza mbere y'uko umwobo ukoresha ibikoresho byo kwitandukanya (urugero, gusora birwanya epoxy) mbere yo gusora bibuza neza iremwa ry'urukiramende.
Guhuza Ibice BidakoraMu bikorwa bigezweho, ibice bidakora bishobora gushyirwa hagati y’udupira dutandukanye cyangwa hejuru y’udupira tw’inkoni mbere yo gushushanya, bigashyirwamo ibyo bice mu gipfunyika. Mu gihe cyo guhuza udupira tw’inkoni tutari twegeranye, hashobora gukoreshwa agasanduku k’imashini kugira ngo byorohereze guhuza.
Kugenzura ubushyuhe: Umwobo w'ibihumyo ugumana ubushyuhe bwinshi kugira ngo habeho uburyo bukwiye bwo gutembera no gushonga neza.
Nyuma yo gushushanya, ibice bikorerwa ubushyuhe nyuma yo gushushanya (gushyushya) kugira ngo bitunganye polimeri kandi bigere ku miterere yuzuye y'ibikoresho.
6. Gutunganya nyuma yo gukoresha ifumbire
6.1 Gukata
Uduti tw'ingomero—uduce tw'icyuma duhuza intoki z'inkoni—turacibwa kugira ngo dutandukanye ibyuma by'inkoni ku giti cyazo mu buryo bw'amashanyarazi. Iki gikorwa cyo gukata gitandukanya matrix y'urukiramende rw'inkoni mu bice bitandukanye by'ipaki.
6.2 Gushyiramo Solder Plating
Ubuso bw'urushundura burasukurwa, bugashyirwaho, kandi bugashyirwamo icyuma kitagira icyuma gikozwe mu ibumba kugira ngo birusheho gusokerwa mu gihe cyo guteranya urushundura. Intambwe yo gukonjesha nyuma yo gusobekeranya ibuza ikorwa ry'urushundura, uburyo bwo kunanirwa bujyana no kurangiza neza icyuma gikozwe mu ibumba.
6.3 Gukora
Imiyoboro y'amashanyarazi iragorama mu buryo bwa mekanike mu buryo bwa nyuma bukwiriye gushyirwa ku buso cyangwa mu ihuriro ry'umwobo. Ibikorwa byo kurema bishobora kandi kuba birimo gutandukanya udupaki dutandukanye n'umurongo w'umuyoboro w'amashanyarazi.
7. Impinduka za Leadframe Package zigezweho
7.1 Biyobowe na BGA (LFBGA)
Ishingiye ku gishushanyo mbonera Pake y'urutonde rw'imipirakoresha imiterere y'urushundura rudafite icyuma kitagira icyuma. Udupira tw'umupira mu cyiciro cyo hejuru duhuzwa n'udupira tw'icyuma mu cyiciro cyo hasi binyuze mu dupira. Nyuma yo gufatanya, gufatana kw'insinga, no gushushanya, inzira yo gukuraho udupira tw'icyuma, ikagaragaza udupira tw'icyuma mu gihe hagumaho neza umupira w'icyuma udasaba agapfukamunwa. Ubu buryo burinda kuva amaraso mu gihe cyo kongera gutembera kandi bukongera ubwizigame bw'ingingo.
7.2 Guhuza Ibikoresho Bitandukanye
Iterambere mu gushushanya leadframe rituma habaho byinshi Chipu ya semiconductors n'amatsinda y'imikorere agizwe n'ibice bitandukanye mu ipaki imwe, byongera ubucucike bw'ihurizahamwe mu gihe bikomeza inyungu z'ikiguzi.
8. Ibitekerezo ku igenzura ry'ubuziranenge
Kugenzura ibikorwa ni ingenzi mu gihe cyose cyo gupakira:
Gutegura urupfu: Gukuraho umuriro udahinduka binyuze mu gusukura amazi adakoreshejwe iyoni
Ubusugire bw'ingoboka: Gupima gukurura no gukata buri gihe
Gutahura Umwanya w'Ibihumyo: Uburyo bwo kugenzura no gukuraho ibintu mu maso
Isuku y'amashusho y'umuyoboro: Gusukura imvange y'ibimera ikoresheje ikoranabuhanga cyangwa imiti
9. Umwanzuro
Gupfunyika ibyuma bikozwe mu buryo bwa "leadframe" biracyari ikoranabuhanga ry'ibanze mu guteranya ibikoresho bya "semiconductor", bihuza imikorere myiza n'iy'ingirakamaro mu bikorwa bitandukanye. Uburyo bwo gukora ibintu bugenda busubira inyuma bugana ku miterere y'ibikoresho, ibikoresho, n'ibipimo by'imikorere kugira ngo haboneke umusaruro mwinshi kandi umusaruro wizewe. Ubwoko bushya nk'ubushingiye kuri "leadframe". Pake ya Bgas zigaragaza iterambere rikomeje ry’iri koranabuhanga rikuze, rihuza n’ibisabwa mu guhuza no gukora neza mu gihe rikomeza kugira inyungu mu bukungu zishingiye ku guteranya ibikoresho bishingiye kuri leadframe.